The difference is contact plating.
ER8-***P-0.8SV-2H :0.76μm gold over 2.54μm nickel Thick plating is required for communication market. (Bellcore specification)
...
The hole size is reduced to stabilize the connector to PCB and prevent connector
from mis-position and rotation during mounting process.
Please refer to FX18 Design Guide Line,...
Insert Interposer by pressing on Installation Cap, then remove Installation Cap.For more information, see the IT3 design note.
IT3 design guideline
https://www.hirose.com/ja...
In case all of 100 pins are used for power, maximum is 62A.
We recommend FX30B series 3 pin instead as maximum is 66A totally.
FX30B series 3 pin is smaller than FX23 series 1...
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