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FAQ
What is the difference between the last digit of TM11R-5M2-88(xx)?
TM11R-5M2-88(00) : 1 μm tin copper plating on dip portion, nickel plating is 0.5 μm nickel underplating, and four directions ground plate(Discontinued).
TM11R-5M2-88(01) : Changed plating on DIP portion to flash gold from (00).
TM11R-5M2-88(02) : Change nickel plating thickness to 1.27 μm or more from (00)(Discontinued).
TM11R-5M2-88(04) : (00) without ground spring on printed circuit board side(Discontinued).
TM11R-5M2-88(01) : Changed plating on DIP portion to flash gold from (00).
TM11R-5M2-88(02) : Change nickel plating thickness to 1.27 μm or more from (00)(Discontinued).
TM11R-5M2-88(04) : (00) without ground spring on printed circuit board side(Discontinued).
TM11R-5M2-88(70) : Changed plating on DIP portion to tin reflow plating from (00).
TM11R-5M2-88(72) : Changed plating on DIP portion to tin reflow plating from TM11R-5M2-88(02) .
TM11R-5M2-88(74) : Changed plating on DIP portion to tin reflow plating from TM11R-5M2-88(04) .
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