Here is the conditions for soldering machine and solder iron.
1 In case of soldering machine
Solder temperature: 245℃, Dip time: 3 seconds
2 In case of solder iron
S...
The difference is contact plating.
ER8-***P-0.8SV-2H :0.76μm gold over 2.54μm nickel Thick plating is required for communication market. (Bellcore specification)
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Please refer to User Guide for Wire-to-Board Connector in our website.Our website>Category>wire-to-boardClick "wire-to-board" and you can see user guide at the bottom.
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